Assembly/Production

Assembly Process Technology

Process technology determines the product’s performance and life.
Reliable process technology is the key for RF Module

Bonding Structure

Assembly order by part temperature characteristics/bonding temperature

Equipment Status (Assembly / Development / Testing)

Assembly Line

Testing Line

Research & Development Lab

ATE (Auto Test Equipment)

Equipment Status (Testing)

Power Supply
Model : DP30-05TP

Oscilloscope
Model : DPO4054

Noise Figure Analyzer
Model : N8975A

Power Meter
Model : ML2438A

Signal Generator
Model : E4421B

Signal Generator
Model : MG3694C

Spectrum Analyzer
Model : 8565E

Spectrum Analyzer
Model : E4446A

Temp & HumiChamber
Model : SJ-TH-S50-100303

Vector Network Analyzer
Model : 37369D

Vector Network Analyzer
Model : 37347E

Temperature Chamber
Model : EN-TH-1000

Equipment Status (Assembly)

Equipment List

Manual Wedge Bonder
Model : 7600B

Manual Wedge Bonder
Model : 1-191-02-04

Manual Wedge Bonder
Model : 7476D-79

HYBOND
Model : 626

Manual Weld Bonder
Model : 1-284-01-01

Manual Eutectic Bonder
Model : 7327C-79

Semi-AUTO Wedge Bonder
Model : 620

Manual Ball Bonder
Model : 7700B

Manual Epoxy Bonder
Model : 7200B

Pull & Shear Tester
Model : 2400A

Measuring Scope
Model : DH2-T2

Hot Plate
Model : GLHP-D3060

Semi-AUTO Wedge Bonder

Wedge Bonder

Epoxy Die Bonder

Eutectic die bonder

Weld Bonder

Hot Plate

Pull & Shear Tester

Dry Oven

Measuring Scope