Assembly/Production
Assembly Process Technology
Process technology determines the product’s performance and life.
Reliable process technology is the key for RF Module
Bonding Structure
Assembly order by part temperature characteristics/bonding temperature
Equipment Status (Assembly / Development / Testing)
Assembly Line
Testing Line
Research & Development Lab
ATE (Auto Test Equipment)
Equipment Status (Testing)
Power Supply
Model : DP30-05TP
Oscilloscope
Model : DPO4054
Noise Figure Analyzer
Model : N8975A
Power Meter
Model : ML2438A
Signal Generator
Model : E4421B
Signal Generator
Model : MG3694C
Spectrum Analyzer
Model : 8565E
Spectrum Analyzer
Model : E4446A
Temp & HumiChamber
Model : SJ-TH-S50-100303
Vector Network Analyzer
Model : 37369D
Vector Network Analyzer
Model : 37347E
Temperature Chamber
Model : EN-TH-1000
Equipment Status (Assembly)
Equipment List
Manual Wedge Bonder
Model : 7600B
Manual Wedge Bonder
Model : 1-191-02-04
Manual Wedge Bonder
Model : 7476D-79
HYBOND
Model : 626
Manual Weld Bonder
Model : 1-284-01-01
Manual Eutectic Bonder
Model : 7327C-79
Semi-AUTO Wedge Bonder
Model : 620
Manual Ball Bonder
Model : 7700B
Manual Epoxy Bonder
Model : 7200B
Pull & Shear Tester
Model : 2400A
Measuring Scope
Model : DH2-T2
Hot Plate
Model : GLHP-D3060
Semi-AUTO Wedge Bonder
Wedge Bonder
Epoxy Die Bonder
Eutectic die bonder
Weld Bonder
Hot Plate
Pull & Shear Tester
Dry Oven
Measuring Scope